Typical investigations performed as part of failure analysis of implants and medical devices include the following:

  • Digital microscopy: Analysis for visual abnormalities, contamination, corrosion, abrasion, wear mechanisms, and notch effects (non-destructive)
  • Determination of wear volume: Tactile measurement of wear volume in mm³ (non-destructive)
  • SEM and EDX examination of fracture surfaces, analysis of fracture type and crack origin, as well as material composition (partially destructive)
  • Metallographic cross-section analysis of implant material (destructive), including microstructure evaluation and examination for inclusions and voids